| 摘要 |
A method of bonding a layer of metal to a ceramic substrate, particularly say, copper to alumina or zirconia, in which the substrate or the metal or both are coated with a solution of oxygen-rich metal salt, eg. copper perchlorate or copper nitrate. The copper layer is assembled to the alumina with the intervening coating and the assembly heated in an inert atmosphere. The copper salt breaks down at about 600 DEG to 700 DEG C leaving a deposit of copper oxide on the ceramic and releasing oxygen which oxidises the copper layer. The two layers of copper oxide then amalgamate in a common melt and provide a firm bond. This method provides a controllable local oxidising atmosphere at the contacting surfaces while the whole assembly is maintained in an inert atmosphere. The salt is preferably a salt of the same metal as the metal which is being bonded. The bonding of the metal to the ceramic substrate may be followed by etching of the metal to produce electric circuitry. |
