发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a primary oxidized film from cracking at the bonding time by rounding the boundary between lead wirings led from the pad and the pad. CONSTITUTION:A pad 21 and the corners (c, d) of lead wirings 22 are bonded with suitable curvature. According to this configuration, an impact at the bonding time can be transmitted to thw wirings 22, a primary oxidized film is not cracked, a margin for the bonding load can be increased, thereby increasing the yield.
申请公布号 JPS5932144(A) 申请公布日期 1984.02.21
申请号 JP19820142914 申请日期 1982.08.18
申请人 TOKYO SHIBAURA DENKI KK 发明人 SAKAGAMI AKIRA
分类号 H01L21/60 主分类号 H01L21/60
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