PROCESS FOR MAKING SUB-MICROMETRIC STRUCTURES AND USE OF THIS PROCESS IN MAKING DEEP DIELECTRIC ISOLATION REGIONS WITH A SUB-MICROMETRIC WIDTH IN A SEMICONDUCTOR BODY,申请号EP19830109945-传众专利搜索

发明名称	PROCESS FOR MAKING SUB-MICROMETRIC STRUCTURES AND USE OF THIS PROCESS IN MAKING DEEP DIELECTRIC ISOLATION REGIONS WITH A SUB-MICROMETRIC WIDTH IN A SEMICONDUCTOR BODY
摘要
申请公布号	EP0111086(B1)	申请公布日期	1989.03.08
申请号	EP19830109945	申请日期	1983.10.05
申请人	IBM DEUTSCHLAND GMBH;INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	TRUMPP, HANS-JOACHIM, DR.;GRESCHNER, JOHANN, DR.
分类号	H01L21/302;C23F4/00;H01L21/033;H01L21/3065;H01L21/308;H01L21/76;H01L21/762;(IPC1-7):H01L21/31	主分类号	H01L21/302
代理机构		代理人
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