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发明名称
SILICON WAFERS FOR INTEGRATED CIRCUIT CHIP FABRICATION
摘要
申请公布号
EP0137914(A3)
申请公布日期
1989.03.08
申请号
EP19840107432
申请日期
1984.06.28
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CASE, STEPHEN WILLIAM;MENDEL, ERIC;PAK, MUN SOK;PATZNER, EUGENE JOSEPH;WILSON, LEON GARDNER, JR.
分类号
H01L21/02;H01L21/208;H01L21/322;H01L21/33;H01L21/331;H01L29/02;H01L29/70;H01L29/73;(IPC1-7):H01L21/322;H01L21/324
主分类号
H01L21/02
代理机构
代理人
主权项
地址
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