| 摘要 |
PURPOSE:To obtain a semiconductor device which is cheap and capable of the replacement of a deflective semiconductor element mounted on it by a method wherein a conductive resin wire is melted by heating to be ball-shaped so as to be applied onto a wiring pattern for the formation of a bump which is jointed with a connecting terminal of a semiconductor element and fixed through an insulating resin. CONSTITUTION:A conductive resin wire 1 is melted by heating through laser light 2, ultraviolet rays or the like so as to be a ball 4 through the surface tension, which is applied to the part of a wiring pattern 7 which is jointed with the connecting terminal of a semiconductor element 10 for the formation of the bump 4. Next, an insulating resin 9 is applied onto the part where the bump 4 is formed or the semiconductor 10 and the connecting terminal of the semiconductor 10 is aligned with the bump 4 in position, where pressure is applied for contacting them closely together squeezing the insulating resin 9 between them out and then they are fixed through hardening. By these processes, a bump can be easily formed in a simple process at low cost and when a defective chip is detected, it can be easily removed only by heating and replaced by a new chip. |
