| 摘要 |
PURPOSE:To obtain a substrate, a surface wiring pattern section of which does not protrude and which has a smooth surface, by pressing green sheets by using a pressing member, a section of which corresponding to the surface wiring pattern section of the substrate projects from the periphery, and indenting the surface wiring pattern section when the green sheets to which specified wiring patterns are formed are laminated. CONSTITUTION:When green sheets to which specified wiring patterns are shaped are laminated, the green sheets are pressed by employing a pressing member, a section of which corresponding to a surface wiring pattern section 3 in a substrate 1 protrudes from the periphery, and the surface wiring pattern section 3 is indented. The quantity of indentation is determined so as to be equivalent to plating film thickness required by the quantity of indentation of the substrate 1 after baking. The substrate 1 is baked, a plating film 5 is attached in an extent that it protrudes from an indentation 4 in the surface wiring pattern section 3, heat treatment is executed as required, and the surface is polished and the whole surface of the substrate 1 including the plating film 5 is finished smoothly. |
