| 摘要 |
PURPOSE:To improve the precision of the polished shape of a wafer by constituting a polishing jig by ingtegrally forming a wafer holding jig and a correcting jig for a polisher, thus preventing the eccentric abrasion of the polisher and permitting the uniform correction and the use for a long time. CONSTITUTION:A wafer 9 moves in reciprocation in the radial direction on a polisher 8 which is attached onto an elastic film 2 on the inner side of the ring inner peripheral part 4 of a wafer holding/polisher correcting ring 3 and on a polisher 8 and is pressed by a swing mechanism part. The polishing agent is dropped at the center part of the polisher 8 by a polishing agent feeding nozzle, and the polisher 8 installed on a lap 10 is revolved by a connected driving part, and the surface of the wafer 9 is mirror-surface-polished. In this case, the outer peripheral part 5 of the wafer holding/correcting ring 3 presses the polisher 8, and the part where the abrasion quantity by the wafer 9 is less is worn out, and the polisher 8 is uniformly corrected, and the wafer 9 is polished with high precision for a long time. |
