| 摘要 |
PURPOSE:To obtain a line with low characteristic impedance without increasing line width, by forming a groove so that a substrate thickness is made thinner than ordinary substrate thickness on the surface of a semi-insulated compound semiconductor substrate equipped with a ground conductor on a rear plane, and forming a conductor line in the groove. CONSTITUTION:The semi-insulated compound semiconductor substrate 1, a microstrip line 2, and the ground conductor 4 are thc same components as used in a conventional device. The groove 5 is formed on the main plane on one side of the substrate 1 by digging the plane from one plane of the substrate 1, and the substrate thickness of the part is formed thin, and the conductor line 13 is formed in the groove 5. Since the characteristic impedance of the line 3 with low impedance can be decided by a ratio of the line width to the substrate thickness if the dielectric constant of the substrate 1 is kept constant, it is possible to form a transmission line with low characteristic impedance without increasing the line width by forming the conductor line 13 in the groove 5. |
