| 发明名称 |
ADHESIVE FOR ELECTROLESS PLATING |
| 摘要 |
<p>PURPOSE:To produce an adhesive for electroless plating having superior heat resistance and bonding strength and leaving no air bubbles after coating, by using acrylonitrile-butadiene rubber contg. a specified percentage of acrylonitrile and resol type alkylphenol resin. CONSTITUTION:An adhesive for electroless plating contg. acrylonitrilebutadiene rubber (NBR) contg. 42 - about 60wt.% acrylonitrile and resol type alkylphenol resin is prepd. The pref. amt. of the NBR blended is 50-75pts.wt. per 100pts.wt. in total of the NBR and phenol resin and the pref. total amt. of them in the adhesive is about 15-25wt.%. The NBR and phenol resin are added to an org. solvent and mixed to obtain the adhesive for electroless plating having superior bonding strength and heat resistance and leaving no air bubbles after coating.</p> |
| 申请公布号 |
JPS63213676(A) |
申请公布日期 |
1988.09.06 |
| 申请号 |
JP19870045158 |
申请日期 |
1987.03.02 |
| 申请人 |
NIPPON MINING CO LTD |
发明人 |
NATSUME TAKASHI;SASA NARIAKI;OGINO YUKIO |
| 分类号 |
C09J121/00;C09J161/06;C23C18/20;H05K3/18;H05K3/38 |
主分类号 |
C09J121/00 |
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