发明名称 SEMICONDUCTOR DEVICE WIRING SYSTEM
摘要 PURPOSE:To increase wiring freedom and to reduce parts that are not wired, by performing wiring at different wiring layers without changing the running direction for a required length, thereafter changing the running direction in the wiring layers, alleviating the restrictions on the running directions of the wiring, and performing wiring. CONSTITUTION:The (y) coordinate of the line segment of a signal wiring, which is each wiring region, is determined for the (x) direction. At this time, on the line segment of another signal wiring in the (x) direction, wiring is performed on the different wiring layer but in the same direction. At this time, whether adverse effects are imparted on another signal or not is checked. When the result is not so bad, wiring is performed on the different wiring layer on the same route. This method is applied in the wiring region from the left end to the right end. When the right-end terminal is located on the upper side of the wiring region when the region is viewed from the left to the right, the line segment, whose wiring layer is changed, is overlapped on another signal wiring on the upper side as much as possible. When said terminal is located at the lower side of the wiring region, the segment is overlapped on another signal wiring on the lower side. In this way, the wiring layer grid of the line segment can be vacated, i. e., the wiring grid where the wiring has been located can be made vacant, Therefore, the freedom of the other signal wirings can be enhanced.
申请公布号 JPS63208241(A) 申请公布日期 1988.08.29
申请号 JP19870040305 申请日期 1987.02.25
申请人 HITACHI LTD 发明人 SEKI MITSUO
分类号 H01L21/82;G11C11/401;G11C11/41;H01L21/3205;H01L23/52;H01L27/118 主分类号 H01L21/82
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