| 摘要 |
<p>PURPOSE:To enable the single power operation of a semiconductor chip, and to miniaturize a device and reduce cost thereof by grounding a predetermined electrode for a semiconductor chip in an AC manner by a capacitor mounted onto a metallic block. CONSTITUTION:Source capacitors 5 are fixed onto a metallic block 2 through soldering, etc., and connected to sources for a GaAsFET chip 1 by gold wires, etc., and capacitors are formed among fixing surfaces with the metallic block 2 and the bonding surfaces of the gold wires. Since the GaAsFET chip 1 is manufactured by using a semi-insulating substrate, it is insulated from gate- drain-source for the GaAsFET 1. The source capacitors 5 are employed as source terminals to an external circuit while the sources for the GaAsFET 1 are grounded to the metallic block 2 in an AC manner. Accordingly, the source capacitors, cost of which is low, are fitted into a semiconductor chip carrier, thus allowing single power operation by a small area without using expensive parts.</p> |
