发明名称 APPARATUS FOR FORMING BALL
摘要 PURPOSE:To reduce the period of time required for completing bonding operation, by providing a discharge electrode having a very small mass such that it can be extended from a gas inlet piple and it moves toward an easily oxidizable metallic wire supplied from a bonding tool. CONSTITUTION:A gas inlet pipe 2 is fixed on a ball forming apparatus 1 such that it is disposed at a position close to a bonding tool 3. A discharge electrode 6 is attached to the pipe 2 such that it is movable toward an easily oxidizable metallic wire 5 supplied from the bonding tool 3. A rod 15 is moved horizontally by operation of an air cylinder 9, so that the electrode 6 is moved. According to such construction, laminar flow formed by inactive or reducing gas essential for formation of balls is not disturbed and, therefore, the time required for completing bonding operation can be reduced.
申请公布号 JPS63174329(A) 申请公布日期 1988.07.18
申请号 JP19870004941 申请日期 1987.01.14
申请人 TOSHIBA CORP;TOSHIBA MICRO COMPUT ENG CORP 发明人 KOBAYASHI HIROAKI;YASUNO KIMIO
分类号 H01L21/60 主分类号 H01L21/60
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