| 摘要 |
PURPOSE:To assure the accurate bonding process making use of compact and accurate support rings by a method wherein the rear surface of a metallic foil in a device hole is exposed and developed to form the support rings. CONSTITUTION:A sensing layer 14 is formed on the rear surface of a device hole of a metallic foil 12 bonded onto a film substrate 10 to form compact and accurate support rings 14a for reinforcement by exposure and development. Later, when another sensing layer is formed on the surface of foil 12 to be exposed, developed and etched, protruding metallic leads 18 can be formed to be bond-connected to the electrode terminals 20 of a chip 19 accurately.
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