| 摘要 |
PURPOSE:To eliminate the deterioration of adhesive resin caused by an organic solvent, gasoline, etc., by joining the periphery of a pedestal in one body by molding. CONSTITUTION:The molding is carried out to the overall length of the periphery of the pedestal 12 and the top surface of a mold housing body is nearly at the same height as the top surface of a sensor element 10, so a bonding wire is easily extended between an electrode lead frame 26 mounted on the top surface of the mold and a diffusion resistance surface. A screw 28, an O-ring groove 30, and the lead frame 26 are formed or inserted simultaneously with the molding. Then the sensor element 10 is joined with the pedestal 12 after the housing body 16, pedestal 12, etc., are molded. They are joined by electric joining which is normally used to join silicone single crystal and glass, and it is natural that no organic adhesive is used. Consequently, the deterioration of the adhesive resin caused by the organic solvent, gasoline, etc., is eliminated.
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