| 摘要 |
PURPOSE:To provide the titled composition outstanding in moisture resistance and mechanical properties, for use in semiconductor devices, etc., comprising an epoxy resin, novolak type phenolic resin, specific fluorine-modified polysiloxane and specific amount of inorganic filler. CONSTITUTION:The objective composition comprising (A) an epoxy resin, (B) a novolak type phenolic resin, (C) a fluorine-modified polysiloxane of formula (n>=1), and (D) 25-90wt% of inorganic filler (pref., silica powder or alumina). Preferably, the equivalent ratio of the epoxy group in the resin A to the phenolic OH group in the resin B fall between 0.1 and 10. The amount of component C to be incorporated is pref. 0.1-20pts. by wt. per 100pts. by wt. of the component D.
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