| 摘要 |
PURPOSE:To obtain a compsn. with which developing time is short and which has an excellent electroplating bath resistant characteristic by incorporating a photosensitive component and binder component consisting of one kind of a specific Br modified bisphenol A type epoxy acrylate formed by modifying both terminals of a specific bisphenol a type epoxy resin with acrylate or methacrylate into said compsn. CONSTITUTION:This compsn. contains the photosensitive component and the binder component consisting of at least one kind of the Br modified bisphenol A type epoxy acrylate which is expressed by the formula and is formed by modifying both terminals of the Br modified bisphenol A type epoxy resin having >=350 epoxy equiv. and Br content of >=30% of the entire part with the acrylate or methacrylate. In the formula, R is CH3 or H, n is 0-5 integer. the photoresist compsn. with which the developing time is short and which is applicable to a solder resist for a printed circuit board having small-diameter through-holes is obtd. |
