| 摘要 |
<p>PURPOSE:To contrive accomplishment of a sharp reduction of the dust adhering to the back side of a wafer by a method wherein projections are provided on the arm or the belt with which the wafer will be conveyed, and the contacting area between the semiconductor wafer and the conveying system is made small. CONSTITUTION:A plurality of projections 2,2... are provided on the upper surface 1a of a semiconductor wafer conveying arm 1. When a semiconductor wafer 3 is conveyed by the conveying arm 1, the semiconductor wafer 3 and the conveying arm 1 are point-contacted by the projections 2, 2..., and the adhesion of dust coming from the conveying arm 1 on the back side of the semiconductor wafer 3 can be reduced.</p> |
