| 摘要 |
PURPOSE:To realize a multifuctional IC by a method wherein semiconductor pellets mounted on lead frames are stacked with a certain space and sealed with resin. CONSTITUTION:A pellet 3a which is mounted on a lead frame 1a and wired 2a and a pellet 3b which is mounted on a lead frame 1b and wired 2b are fixed with a certain space between each other and sealed with resin. With this constitution, the occupied area of IC can be reduced and multiple functions can be provided. |
