| 摘要 |
PURPOSE:To realize an IC card wherein a semiconductor device will not peel off from the card even after the card has experienced a multiplicity of bends by a method wherein a semiconductor device that is a package substrate mounted with a semiconductor element is installed on a thin flexible substrate and there are corrugated regions provided at prescribed positions in the semiconductor device surfaces in contact with the thin flexible substrate. CONSTITUTION:A semiconductor element is packaged in an encapsulating resin 41 and, on the rear surface 30b of a flexible organic insulating film 30 to be in contact with a card 50, corrugated regions 35 are formed, which is accomplished mechanically or chemically. A corrugated region 42 is formed on the encapsulating resin 41, on its surface nearer to the rear surface 1b of the semiconductor element 1, which is accomplished by application of a corrugation forming jig to the encapsulating resin 41 during the encapsulating process. With corrugation in presence at prescribed regions on semiconductor device surfaces to be in contact with a card, area of contact between the two may be larger, which enhances the strength of adhesion between the semiconductor device and the card. |
