| 摘要 |
<p>PURPOSE:To make the temperature history of a body to be treated uniform, by reciprocating the bodies to be treated in the direction of the axis of a treating chamber, and carrying them outward according to the order in which they are carried in. CONSTITUTION:Bodies 8 to be treated such as semiconductor wafers subjected to ion implantation are supplied to a treating chamber 2 by a carrying guide 7. A transferring jig 9 comprizes a pair of retaining guides 9d and 9e which repeats opening and closing, and a pair of retaining guides 9i and 9j which repeats opening and closing and up-and-down movement corresponding to a duct pitch. This transferring jig delivers alternately the bodies 8 to be treated between a channel 9 which is arranged in face of 9d and 9c and a channel 9h which is arranged in face of 9i and 9j. Thereby the bodies 8 to be treated are carried up on the closed end side of the treating chamber 2. A transferring jig 12 delivers the bodies 8 to be treated which are carried to the uppermost part of the transferring jig 9 to that of the transferring jig 11. By the similar operation to the transferring jig 9, the transferring jig 11 carries the bodies 8 to be treated down to the aperture end side of the treating chamber 2, and delivers the bodies 8 to be treated to a carry-out guide 10.</p> |
