| 摘要 |
PURPOSE:To be able to freely connect the bonding pads of semiconductor elements by using through hole plating and both-side interconnection circuit sheet interconnected between both front and rear surfaces between semiconductor elements as intermediate layer. CONSTITUTION:Holes 7 are opened at an insulating sheet 5, and sprocket holes are simultaneously opened at both sides of a tape. Then, a metal foil tape coated with an adhesive layer 6 is bonded to the front surface of the sheet 5, and patterned to form a surface conductive layer 8. Similarly, an adhesive layer 9 is used to form a rear surface conductive layer 10. Then, through holes 11 are formed by punching at front and rear surface conductive layers 8, 10. Subsequently, a metal plating film 12 is formed on the layers 8, 10, and the holes 11 are then connected by soldering 13 to produce both-side interconnection circuit sheet 20. |
