| 摘要 |
PURPOSE:To obtain a multilayer circuit board low in the irregularity of a dimensional change ratio and reduced in slipping, by continuously molding laminates each formed by laminating a copper foil or prepreg to an inner layer plate one at a time by a W-belt press machine. CONSTITUTION:Laminates each formed by laminating a copper foil or prepreg 4 to an inner layer plate 5 are continuously sent one at a time and molded between the double steel belts 1 of a W-belt press machine 2. By this method, difference becomes hard to generate in a molding condition and the irregularity of a dimensional change ratio is reduced. Further, since the laminates can be molded one at a time, low pressure molding can be performed and slipping is eliminated and, therefore, a resin can be sufficiently applied, to the inner layer circuit of the inner layer plate and a measling property is improved. |
