发明名称 |
PROCESSO PARA PREPARACAO DE COMPOSICAO RETICULAVEL POR CALOR,COMPOSICAO,REMENDO DE REFORCO DE METAL E PROCESSO PARA REFORCAR SUBSTRATO METALICO |
摘要 |
<p>A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network.</p> |
申请公布号 |
BR8700359(A) |
申请公布日期 |
1987.12.08 |
申请号 |
BR19878700359 |
申请日期 |
1987.01.27 |
申请人 |
ESSEX SPECIALTY PRODUCTS, INC. |
发明人 |
SIDKY D. RIZK;JOHN W. POWER;NAVINCHANDRA B. SHAW |
分类号 |
C08G18/10;C08G77/458;C09J175/04;(IPC1-7):C08L75/04;C08J5/12 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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