| 摘要 |
PURPOSE:To obtain a metallic laminate electrode, which can ensure ohmic contacts by forming metallic films onto an Si chip and by heat treatment and can acquire strong bonding power by soldering, by laminating first-fourth layers each consisting of specific metals onto an Si substrate. CONSTITUTION:A laminate composed of a first layer consisting of an Sn alloy, a second layer made up of an Sn-Ni alloy or an Sn-Fe alloy, a third layer composed of a Ni-Si or Ni-Si-B amorphous alloy or an Fe metal, a fourth layer consisting of a Ni-Si or Fe-Si alloy and an Si substrate in succession from the surface is used. The third layer made up of the Ni-Si or Ni-Si-B amorphous alloy or the Fe metal is shaped onto the Si substrate, and the fourth layer composed of the Ni-Si or Fe-Si alloy is formed on the interface of the Si substrate and the third layer through heat treatment. The first layer consisting of the Sn alloy is shaped onto the surface of the third layer, and the second layer made up of the Ni-Sn or Fe-Sn alloy layer is formed on the interface of the first layer and the third layer through heat treatment, thus manufacturing the metallic laminate.
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