| 摘要 |
PURPOSE:To obtain the state of joining having high reliability in the case of a dipping in molten solder by forming a projecting section on the side, where a collar for a conductor pin is brought into contact with a substrate for loading a semiconductor, and shaping a predetermined clearance between the collar for the conductor pin and the substrate. CONSTITUTION:A conductor pin 10 and a through-hole 21 are joined by dipping a substrate for loading a semiconductor in molten solder from the pin 10 side. Projecting sections 31 are shaped on the side, where a collar 12 for the pin 10 is brought into contact with the substrate for loading the semiconductor, at that time, and a prescribed clearance is formed between the substrate for loading the semiconductor and the collar 12. Consequently, a gas generated by the gasification of a molten section in flux generated in case of a dipping in molten solder passes on the substrate through the clearance. Solder 30 also permeates easily without leaving the residue of flux in the through-hole 21, and the inside of the through-hole 21 is filled with solder in a shorter time. Accordingly, the through-hole 21 and the pin 10 are electrically joined completely. |
