发明名称 |
Semiconductor wafer mounting and cutting system |
摘要 |
A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The system further includes a controlling device for forming a relative relation signal showing a relative relation between a first indication which has been or is applied to the frame and a second indication of the wafer, which wafer has been or is mounted to the frame, and memory means for memorizing the relative relation signal formed by the controlling device.
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申请公布号 |
US4696712(A) |
申请公布日期 |
1987.09.29 |
申请号 |
US19850791488 |
申请日期 |
1985.10.25 |
申请人 |
DISCO ABRASIVE SYSTEMS, LTD. |
发明人 |
NONAKA, YUZO |
分类号 |
H01L21/301;B28D5/00;H01L21/00;H01L21/02;H01L21/67;H01L21/68;(IPC1-7):B32B31/18 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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