| 摘要 |
PURPOSE:To improve reliability by increasing the strength of the connection of a soldered region and making its structure difficult to be affected by an external stress by soldering an expansion formed at one end of a round-bar-like lead wire and part of the round bar continuous to the expansion with a wiring formed on a substrate. CONSTITUTION:A lead wire has a round bar 43 and a flat 44 which is formed at the end of the round bar 43 and is soldered with the land 3 of a wiring provided on a substrate 2. The flat 44 and part of the round bar continuous to the flat of the lead wire 4 are soldered with the land 3. In this structure, the strength of the soldering of the lead wire 4, i.e., the strength against peeling, is increased and an external peel stress has difficulty in effecting since the lead wire 4 is the round bar. |
