| 摘要 |
<p>1. A circuit module which can be well cooled and which carries an electrical component (MP/H), comprising a carrier (T), consisting, for example, of ceramic or synthetic resin, which carries conductors applied to a first surface thereof, a window (F) or a through bore in the carrier (T), a metal cooling plate (KB) which covers at least a part of a second surface of the carrier (T), lying opposite to the conductors, around the window (F), and a solid metal, preferably round, cooling block (B) which is arranged in the window (F) and which, is located between, on the one hand, the electrical component which is arranged in and/or on the window (F), is conductively connected to the conductors, for example, by wires (D), and which emits heat due to losses during operation, and, on the other hand, the cooling plate (KB), with a low heat transmission resistance between the component (MP/H) and the cooling plate (KB), characterised in that an opening is provided, in alignment with the window (F), in the cooling plate (KB) under the window (F) and the cooling block (B) is provided at its end which faces away from the cooling plate (UB) and is near to the first surface, with a rivet head (NK) on which the electrical component (MP/H) - e.g. a semiconductor chip (H) and/or a laser and/or a resistance layer and/or a micropack (MP) - is arranged, is milled at least at clamping sections of its side surfaces, and is clamped in the window (F) and/or in the opening of the cooling plate (KB) in self-locking fashion.</p> |
