| 摘要 |
PURPOSE:To obtain a simple packaging apparatus for a semiconductor device and the like adapted for multiple sort and small quantity production by separably moving both molding heads along rails, and introducing an engaging portion into the engaging hole of a bonded plates. CONSTITUTION:Molding heads 3, 4 are opposed over rails 61 laid on a base 60 in a slidable state. A synchro belt 63 driven circularly by a motor 62 mounted at the end of the base 60 is secured to the heads 3, 4, and the secured positions of the belt 63 are reverse at right and left sides at the heads 3 and 4 as seen from the side of the motor 62. Rotary heads 5, 6 are rotatably supported between the side plates 64 and 64 of the heads 3, 4, and normally or reversely rotatably driven by a motor 69 mounted on the side plate 64 through two sets of miter gears 67, 68.
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