A PROCESS AND APPARATUS FOR ELECTROPLATING COPPER FOIL

摘要

A process and apparatus for producing surface treated metal foil. The process comprises plating a relatively smooth metal foil onto a cathodic surface (12) and thereafter forming a dendritic layer on the foil and firmly bonding it thereto while the foil is still on the cathodic surface (12). In one embodiment, the apparatus comprises an electrolytic cell containing an electrolyte (14), a rotating drum cathode (12) at least partially immersed in the electrolyte (14), at least two primary anodes (16) (17) and at least one pulse plating treatment anode (14).