| 摘要 |
PURPOSE:To facilitate the soldering of a joint and to attain impedance matching by setting the width of a feeding part of an antenna conductor bonded with a terminal chip larger than the outer diameter of the terminal chip. CONSTITUTION:An opening part 43 is formed to a protention layer 16 near a feeding part 20 and a land 30 having a larger diameter (l3) than a wire width (l2) of the feeding part 20 is formed to the opening part. In selecting the outer diameter (l3) of the land 30 larger than the outer diameter of a terminal chip 22, since a throughhole is provided to the land 30, the terminal chip 22 is inserted thereto for soldering, then the soldering is facilitated. Further, solder 46 is padded on the land 30, then the solderability is improved. In this case, the impedance matching is attained by taking the outer diameter (l3) of the land 30 and the outer diameter (l4) of the terminal chip 22 into account.
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