ELEKTRISCHES VERBINDUNGSBAUTEIL UND VERFAHREN ZU DESSEN HERSTELLUNG

摘要

An interconnecting package for attaching electronic devices, such as semiconductor chips, to an interconnection board and processes for the production and mounting thereof. The interconnection package comprises a multiplicity of metallic leads or pins aligned in a regular array and a first substrate of molded plastic material around the metallic leads or pins with the metallic leads or pins extending through the first substrate. A conductive pattern is formed on a surface, the conductive pattern being adapted to electrically connect to the electronic device, and the conductive pattern extends into a multiplicity of recesses. Each of said metallic leads or pins extends into a corresponding recess and makes an electrical connection to the conductive pattern within the recess.