| 摘要 |
PURPOSE:To obtain the titled composition excellent in moldability and capable of giving a molding excellent in low thermal expansion and thermal conductivity, by mixing a specified epoxy resin with an epoxy resin curing agent and an inorganic filler. CONSTITUTION:100pts.wt. epoxy resin (A) of the formula (wherein n is 0-2), e.g., one derived from diphenyl sulfone, is mixed with 1-100pts.wt. epoxy resin curing agent (B) (e.g., phenol novolak resin) and 50-90wt%, based on the composition to be obtained, inorganic filler (C) (e.g., silica powder) of a particle diameter of 0.2-500mum and, optionally, a cure accelerator (e.g., 2-phenylimidazole), a flame retardant (e.g., phosphorus compound), an internal mold release (e.g., carnauba wax), a silane coupling agent, a pigment, etc.
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