MEASURING METHOD FOR PLATED FILM THICKNESS OF SEMICONDUCTOR DEVICE,申请号JP19850224405-传众专利搜索

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发明名称	MEASURING METHOD FOR PLATED FILM THICKNESS OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS6284530(A)	申请公布日期	1987.04.18
申请号	JP19850224405	申请日期	1985.10.07
申请人	NEC CORP	发明人	KOBAYASHI TAKAAKI
分类号	H01L21/66	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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