| 摘要 |
PURPOSE:To provide the titled composition composed of an epoxy resin, a hardener containing phenolic OH, an organic phosphine compound and a metal complex salt dye, giving a cured material having excellent thermal cycling resistance and moisture resistance and suitable for a resin-encapsulated semiconductor device. CONSTITUTION:The objective composition contains (A) an epoxy resin (preferably novolac epoxy resin having an epoxy equivalent of 170-300), (B) a hardener having >=2 phenolic OH groups in one molecule (preferably a novolac phenolic resin), (C) preferably 0.01-5wt% organic phosphine compound [e.g. the compound of formula (R1-R3 are organic group) such as triphenylphosphine] and (D) preferably 0.05-10wt% metal complex salt dye (e.g. O,O'-dioxyazo dye containing chromium). |
