发明名称 |
Bath and process for plating tin/lead alloys on composite substrates |
摘要 |
An electroplating bath and process for electroplating composite substrates having an electroplatable metallic portion and a non-conductive inorganic portion with a tin-lead alloy which will plate only on the metallic portions of the substrate and not plate on or otherwise adversely affect the non-conductive inorganic portions.
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申请公布号 |
US4640746(A) |
申请公布日期 |
1987.02.03 |
申请号 |
US19850774822 |
申请日期 |
1985.09.11 |
申请人 |
LEARONAL, INC. |
发明人 |
NOBEL, FRED I.;SCHRAM, DAVID N. |
分类号 |
C25D3/60;C25D5/02;H05K3/34;(IPC1-7):C25D5/02 |
主分类号 |
C25D3/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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