| 发明名称 |
A method for preparing a printed circuit board. |
| 摘要 |
<p>The invention provides a method for preparing a printed circuit board with solder plated circuit and :hrough-holes, using a specifically prepared ohotoresist material and a combination of exposure, development, solder plating and etching means.</p><p>This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.</p> |
| 申请公布号 |
EP0204415(A2) |
申请公布日期 |
1986.12.10 |
| 申请号 |
EP19860303108 |
申请日期 |
1986.04.24 |
| 申请人 |
NIPPON PAINT CO., LTD. |
发明人 |
ISHIKAWA, KATSUKIYO;NISHIJIMA, KANJI;SEIO, MAMORU C/O NIPPON PAINT CO |
| 分类号 |
H05K3/42;G03F7/004;G03F7/16;H05K3/06;H05K3/10;H05K3/34;(IPC1-7):H05K3/34;G03F7/10 |
主分类号 |
H05K3/42 |
| 代理机构 |
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代理人 |
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| 主权项 |
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