DIE FOR MOULDING LEADS OF ELECTRONIC COMPONENTS,申请号SU19853891312-传众专利搜索

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发明名称	DIE FOR MOULDING LEADS OF ELECTRONIC COMPONENTS
摘要
申请公布号	SU1274167(A1)	申请公布日期	1986.11.30
申请号	SU19853891312	申请日期	1985.04.29
申请人	MALAKEJ NIKOLAJ A,SU	发明人	MALAKEJ NIKOLAJ A,SU
分类号	H05K13/00	主分类号	H05K13/00
代理机构		代理人
主权项
地址

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