| 摘要 |
PURPOSE:To prevent the occurrence of the failure and to improve the quality and yield ratio by providing a suction means sucking the microscopic extraneous matter away from a wafer. CONSTITUTION:A rail 6 is arranged on the lower, both sides in the longitudinal direction of the heater plate 5. A movable suction head 1 is placed on the rail 6 along the longitudinal direction of the plate 5. A suction hole 1a is arranged on the both sides of the head 1 facing the plate 5. The suction hole 1a is connected to the vacuum line 3 through the vacuum pressure adjustment cock 2 and is vacuum-sucked by a vacuum equipment. Then, microscopic extraneous matter on the wafer 4 and the plate 5 is sucked from the suction hole 1a and removed, thereby preventing the occurrence of failure and improving the quality and yield ratio. |
