发明名称 THE DISCHARGE OF HEAT FROM CIRCUITS
摘要 1. An arrangement for discharging the heat resulting from power loss in layer circuits, to a metallic housing which accommodates the layer circuits, by means of a flexible and heat-conducting stranded connecting element one end of which is connected to the layer circuit and the other end of which is attached to a heat-discharging part of the housing, characterised in that both ends of the connecting element are provided with a massive, heat-conducting terminal contact having good thermal conductivity and also having a contact surface area which is a factor of 5 to 10 times smaller than the substrate surface area of the layer circuit, that that terminal contact of the connecting element which is connected to the layer circuit is arranged on the rear of the substrate in the direct vicinity of the heat source with an interlying flexible metal sheet of good thermal conductivity, and that the heat-conducting metal sheet which is bonded to the substrate simultaneously forms an electrical screening metal sheet shaped for connection to earth terminals of the layer circuit.
申请公布号 AU554687(B2) 申请公布日期 1986.08.28
申请号 AU19840032383 申请日期 1984.08.24
申请人 SIEMENS A.G. 发明人 KARL GERD DREKMEIER;EGON REITHMAIER
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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