发明名称 SOLDER RESIST INK COMPOSITION
摘要 <p>PURPOSE:To provide the titled composition composed of a specific linear high- molecular cresol-novolac resin, an epoxy resin, an amine-type cure accelerator and a specific solvent, giving a cured coating film having excellent heat- resistance, chemical resistance and adhesivity to various substrate and applicable by screen printing. CONSTITUTION:The objective composition contains (A) a linear high-molecular cresol-novolac resin having a number-average molecular weight of >=1,500 and excellent solubility in solvents, and selected from (i) o-cresol-novolac resin and (ii) o-cresol/p-cresol random-copolymerized novolac resin having a molar ratio of copolymerized o-cresol/p-cresol of >=50/50, (B) an epoxy resin having >=2 epoxy groups, (C) an amin-type cure accelerator, and (D) a solvent of formula I-III (R is R' ar 1-8C alkyl; n is 1-4). The amount of the epoxy group in the component B is 0.5-1.5 equivalent per 1 equivalent of the OH group of the component A. The amounts of the components C and D are 0.01-10pts.(wt.) and 20-100pts. per 100pts. of A+B.</p>
申请公布号 JPS61171782(A) 申请公布日期 1986.08.02
申请号 JP19850010948 申请日期 1985.01.25
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 NAKANO YOSHITOMO;KADA MASUMI
分类号 C09D11/00;C09D11/033;C09D11/10;C09D11/103;H05K3/28 主分类号 C09D11/00
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