| 摘要 |
PURPOSE:To obtain an apparatus and a method providing the simplified structure having a very high aligning accuracy, high productivity and high flexibility by executing the alignment with a plurality of alignment marks on the wafer of a plurality of off axis optical system opposed sequentially. CONSTITUTION:In the case of exposing the region B after the end of exposure of the region A, distance is measured by previously detecting the surface position of wafer of the region B to be exposed by the air sensor nozzle AB1 before exposure of B and this measured value is given as a drive command value to a register 43Z by a microprocessor 40Z. While, the exposing region B is located under a reduction lens OP by moving a wafer WX in the direction X, a piezoelectric element ZP continues driving on the basis of a measured value, and the driving is completed when the required movement is terminated by confirming movement with an eddy current type position sensor IS. While the wafer WF moves to the exposing region B from the exposing region A, the focusing of the next exposing region B terminates. |
