MANUFACTURE OF SEMICONDUCTOR DEVICE UTILIZING LEAD FRAME

摘要

PURPOSE:To produce a semiconductor device fit for the standard even if the pitch between leads happens to contract due to the contraction of resin after molding process by a method wherein, when a lead frame is formed, the contraction allowance of pitch between leads due to the contraction of resin is added to the pitch between leads conforming to the standard value. CONSTITUTION:A lead frame 8 is formed of multiple tabs 10 arranged between two outer frames 9 separating from each other in the longitudinal direction of outer frames as well as multiple leads 12 one end of which approach to the tabs 10 while the other ends of which extend in the longitudinal direction of outer frames or in the direction perpendicular to said longitudinal direction. The nominal standard value and any value exceeding the standard value are alternately applied for the pitch between leads 12 of lead frame 8. Through these procedures, a semiconductor device fit for the standard specification may be produced since even if the pitch between leads happens to contract due to the contraction of resin, the contraction may be offset by the contraction allowance preliminarily set up.