| 摘要 |
<p>A contact plater apparatus (11) and method for plating selected areas of a web workpiece (39) wherein the web workpiece (39) and anode (107) are in close proximity, separated only by the brush belt (35) that contacts the web workpiece (39). A box manifold (83) continuously replenishes with plating solution, provides the brush belt (35) with plating solution from openings (87) in a header (12) as the solution passes over an anode (107). The brush belt (35) of open-cell foam or other absorbent material wicks up the plating solution and brushes it on the desired spot on the cathodic web workpiece (39). The brush belt (35) is guided past the box manifold (83) in an accurately defined path. The web workpiece (39) and brush belt (35) are brought into contact at the openings in the header (12) of the box manifold (83) where the plating takes place. The brush belt (35) has a continuous loop of backing material (69) that has considerable structural stability and is impervious to the plating fluid. The absorbent material is carried by this backing material (69). The belt (35) is structured so that it is structurally stable, impervious to the plating solution and only applies the minimum amount of required plating solution to the desired zone on the web workpiece (39).</p> |
