Aromatic allyl amine thermosetting resin composition.

摘要

A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: <CHEM> wherein Ar is a divalent aromatic residue, and R1, R2, R3 and R4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.