发明名称 |
MATERIAL FOR PRINTED CIRCUIT BOARD |
摘要 |
<p>A material for printed circuits is disclosed. The material consists of woven glass fiber cloth in which the warp is of plied yarn (12) and the fill is of unplied or twisted yarn (13) to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability. </p> |
申请公布号 |
JPS616346(A) |
申请公布日期 |
1986.01.13 |
申请号 |
JP19850064028 |
申请日期 |
1985.03.29 |
申请人 |
INTERN BUSINESS MACHINES CORP |
发明人 |
ANIRUKUMAARU CHINUPURASADO BAATO;DONARUDO EDOWAADO DOORAN;JIEEMUZU UOORESU NAITO |
分类号 |
B32B15/08;B32B5/08;B32B15/14;B32B17/04;D03D1/00;D03D15/00;D03D15/12;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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