首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
A SPUN FIBRE YARN AND A PROCESS AND APPARATUS FOR ITS MANUFACTURE
摘要
申请公布号
GB2127870(B)
申请公布日期
1986.01.08
申请号
GB19830025062
申请日期
1983.09.20
申请人
* RHONE-POULENC FIBRES
发明人
MICHEL * BUZANO
分类号
D02G3/22;D02G3/36;(IPC1-7):D02G3/34;D02G1/16
主分类号
D02G3/22
代理机构
代理人
主权项
地址
您可能感兴趣的专利
NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD FOR PRODUCING SAME
HIGH-LUMINANCE NITRIDE LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
METHOD FOR GROWING A NITRIDE-BASED III-V GROUP COMPOUND SEMICONDUCTOR
PHOTON COUNTING SEMICONDUCTOR DETECTORS
SEMICONDUCTOR DEVICE, OPTICAL SENSOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
SOLAR CELL
SOLAR CELL
Semiconductor Device
Semiconductor Structure For Flash Memory Cells And Method Of Making Same
DIAMOND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
LIGHT RECEIVING ELEMENT, IMAGE CAPTURING ELEMENT INCLUDING THE LIGHT RECEIVING ELEMENT AND IMAGE CAPTURING APPARATUS INCLUDING THE IMAGE CAPTURING ELEMENT
LIQUID CRYSTAL DISPLAY
SEMICONDUCTOR DEVICE, MODULE AND SYSTEM EACH INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
STANDARD CELL GLOBAL ROUTING CHANNELS OVER ACTIVE REGIONS
ACCESSING OR INTERCONNECTING INTEGRATED CIRCUITS
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE
