发明名称 BONDING FINE WIRE FOR SEMICONDUCTOR
摘要 PURPOSE:To obtain bonding fine wirings having excellent corrosion resistance and waterproofness by forming a Zn-containing layer on the surface layer of Au, Pd or Al or their alloy wire. CONSTITUTION:Zn is coated on the surface of Al, Au, Pd or their alloy wire by plating, depositing or sputtering. After Zn is coated by an arbitrary method on a thick wire as a method having high productivity, the wire is elongated to the final diameter. In this case, since Zn is diffused and alloyed by machining heat, the quality is frequently excellent. Corrosion preventive effect can be effectively performed with 0.7wt% or higher of Zn and particularly low density of 1-4%, thereby eliminating the influence to a bonding such as alloying or diffusion defect by the heat at the bonding time.
申请公布号 JPS60236252(A) 申请公布日期 1985.11.25
申请号 JP19840093195 申请日期 1984.05.10
申请人 FURUKAWA DENKI KOGYO KK 发明人 SHIGA SHIYOUJI;TANIGAWA TOORU
分类号 H01L21/60;H01L23/49 主分类号 H01L21/60
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