| 发明名称 |
Integrated circuit package system with ground bonds |
| 摘要 |
An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.
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| 申请公布号 |
US8062934(B2) |
申请公布日期 |
2011.11.22 |
| 申请号 |
US20070766785 |
申请日期 |
2007.06.21 |
| 申请人 |
PUNZALAN JEFFREY D.;BATHAN HENRY DESCALZO;CAMACHO ZIGMUND RAMIREZ;STATS CHIPPAC LTD. |
发明人 |
PUNZALAN JEFFREY D.;BATHAN HENRY DESCALZO;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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