| 摘要 |
PURPOSE:To release wafer-chucking without shocking a wafer by providing a mechanism vertically moving a member fixing and holding an elastic supporter. CONSTITUTION:A wafer hold-down 19 is fitted to an electrode holder 15 and a connecting rod 31 penetrating an insulator 26, and moved vertically as shown in the figure by a drive 32 such as a solenoid. O rings 33 are mounted to the electrode holder 15, and a seal L and the inside of a chamber 17 are kept vacuum. When etching is completed and the connecting rod 31 is pushed up, a wafer hold- down surface 30 is detached from a wafer 5 because the outer circumferential section of the wafer 5 is pressed down by the resilient force of a plurality of elastic supporters 29 for the wafer hold-down 19. When the wafer hold-down surface 30 is further moved upward, the elastic supporters 29 are separated while pushing down the wafer 5. |
